8 Zone SMT Vacuum Reflow Oven Machine 380V 50Hz CNSMT H8835M
8 Zone SMT Reflow Oven- CNSMT-H8835M
CNSMT is one of the leading manufacturer of SMT reflow oven in China, we provide you all the models of the solder reflow ovens, with good quality and competitive price.if you have any need , kindly contact us now!
We produce all kinds of reflow soldering machines,Including economic,Medium and large 8 zone reflow ovens, bellow is the Medium model:
eight temperature zone reflow oven Features:
MAIJIE heating wire heating technology, independent wind structure, upper and lower heating methods, high thermal efficiency, rapid heating, about 20 minutes from room temperature to set working temperature, the difference between the set temperature of the welding zone and the actual temperature is less than 30 ℃.
·Using Taiwan Mitsukoshi special high temperature motor, direct drive hot air heating, hot air balance, low noise, low vibration, 0201 components can not shift during transportation.
·Unique air duct design, uniform air distribution, large heat capacity, preheating zone, constant temperature zone and welding zone heating up and down, independent circulation, independent temperature control, the temperature control accuracy of each temperature zone is ±1℃, the furnace opening adopts electric top cover type .
·Suitable for debugging the temperature curves of various models, with double or triple soldering zone settings, three-wire PROFILE TEST △ T as small as 8 ℃, and the connection curve test is especially compatible with Japanese or European and American standard lead-free soldering processes.
·Using a newly designed special transportation guide rail, made of high-temperature resistant, wear-resistant aluminum alloy, high rigidity and no deformation.
The guide rail width adjustment system adopts a gear rack coaxial width adjustment device to ensure that the guide rail parallelism reaches ±5MM, which effectively prevents the occurrence of board jamming and board drop. And equipped with automatic and manual width adjustment device.
·The transportation system adopts Delta frequency converter stepless frequency conversion speed regulation, imported ZD motor drive, high-quality carbon steel chain and SUS316 stainless steel mesh belt for synchronous transportation, further ensuring smooth transportation. It is also equipped with UPS uninterruptible power supply and manual shake-out function, which can effectively prevent the PCB from being burned in the furnace due to sudden power failure.
·It has the function of timing automatic dripping and PCB counting.
·Adopt high-quality industrial computer control, LCD display, Windows XP operating system, flexible curve test and powerful dynamic curve analysis function, and all data can be printed and saved to meet the lead-free process.
·All electrical components are imported, and all signal wires are shielded to ensure long-term SMT 24-hour stable and reliable operation
Specification H8835
SMT 8 zones reflow oven | way to control | Computer control |
SMT 8 zones reflow oven | Number of heating zones | 8 small circulation heating zones on the upper and lower sides |
SMT 8 zones reflow oven | heating method | Up and down hot air |
SMT 8 zones reflow oven | Length of heating zone | 3130MM |
SMT 8 zones reflow oven | Conveyor belt width | 450MM |
SMT 8 zones reflow oven | PCB size | 50-350 MM |
SMT 8 zones reflow oven | PCB limit is high | 25 MM |
SMT 8 zones reflow oven | Transmission direction | Left to right |
SMT 8 zones reflow oven | Delivery method | Mesh belt + rail |
SMT 8 zones reflow oven | Conveyor belt height | 900±20 MM |
SMT 8 zones reflow oven | PCB transportation speed | 0~1.8m/min |
SMT 8 zones reflow oven | Temperature control accuracy | ±1-2℃ (static) |
SMT 8 zones reflow oven | Temperature control range | Room temperature~300℃ can be set |
SMT 8 zones reflow oven | Applicable solder type | Lead-free solder/leaded solder |
SMT 8 zones reflow oven | Temperature control method | PID+SSR |
SMT 8 zones reflow oven | power supply | 380V, 50HZ, three-phase five-wire |
SMT 8 zones reflow oven | Starting power | 48KW |
SMT 8 zones reflow oven | Operating power | 10-15KW |
SMT 8 zones reflow oven | Running speed | Approx.20min |
SMT 8 zones reflow oven | Dimensions | 4800*1100*1350MM |
SMT 8 zones reflow oven | weight | 1500kg |
SMT 8 zones reflow oven | PLC | GUXIN |
SMT 8 zones reflow oven | Solid state | Yangming (40A) |
SMT 8 zones reflow oven | Hot air motor | Mitsukoshi Taiwan |
SMT 8 zones reflow oven | cooling fan | Mitsukoshi Taiwan |
SMT 8 zones reflow oven | Governor | Taiwan Jinyou |
SMT 8 zones reflow oven | Transport motor | Taiwan Jinyou |
SMT 8 zones reflow oven | Contactor | Normality |
SMT 8 zones reflow oven | Delayer | RKC |
SMT 8 zones reflow oven | switch | Schneider |
SMT 8 zones reflow oven | Heating wire | Taiwan Taiwan Exhibition |
8zone smt reflow oven Installation and use conditions
<1>Working voltage: AC380V 50HZ three-phase five-wire system.
<2> Ambient temperature: 5~40℃;
<3>Relative humidity: not more than 85%RH;
<4>Power switch: air switch
<5> Installed power: 48KW
<6>The ground is flat, and there should be no strong vibration and corrosive gas in the surrounding environment.
How to Check the 8 zone reflow oven curve
Temperature and time of eight temperature zones:
Temperature zone 1: 148 degrees;
Temperature zone 2: 180 degrees;
Temperature zone 3: 183 degrees;
Temperature zone 4: 168 degrees;
Temperature zone 5: 174 degrees;
Temperature zone 6: 198 degrees;
Temperature Zone seven: 240 degrees;
temperature zone eight: 252 degrees;
transportation speed: 0.6m/min; over-temperature alarm is set at 10 degrees.
Generally speaking, reflow soldering has only four temperature zones: preheating zone, constant temperature zone, reflow soldering zone, and cooling zone.
Regardless of how many temperature zones are used for reflow soldering, their temperature settings are set according to the principle of action of these four temperature zones. Generally, there are more eight-temperature zone reflow soldering on the market.
There is a certain temperature difference between the actual measurement temperature of reflow soldering and the set temperature of reflow soldering.
In fact, the high soldering temperature of lead-free reflow soldering is 245 degrees. The temperature of reflow soldering is set according to the temperature curve provided by the solder paste factory and the actual soldering product
Lead-free process: preheating zone: heating rate is 1.0~3.0℃/sec; immersion zone: heating rate is less than 2℃/sec, time 70~130℃/sec, temperature: 160~200℃; reflow zone: highest The temperature is 220~250℃, and the time above 220℃ is 30~90 seconds; cooling zone: the cooling rate is less than 4℃/s, the cooling termination temperature is preferably not higher than 75℃
CNSMT8 temperature zone reflow soldering temperature zone is mainly divided into four temperature zones: preheating zone, constant temperature zone, welding zone, and cooling zone.
Preheating zone
Preheating is the first stage of the reflow process. During this reflow phase, the entire circuit board assembly is continuously heated towards the target temperature.
The main purpose of the preheating stage is to make the entire circuit board assembly safely reach the pre-reflow temperature. Preheating is also an opportunity for degassing of volatile solvents in the solder paste. In order for the paste-like solvent to be properly discharged and the components to safely reach the pre-reflow temperature, the PCB must be heated in a consistent linear manner.
An important indicator of the first stage of the reflow process is the temperature slope or temperature rise time. This is usually measured in degrees Celsius, C/s per second.
Many variables can affect this data, including: target processing time, solder paste volatility, and component considerations. It is important to consider all these process variables, but in most cases, consideration of sensitive components is crucial. "If the temperature changes too quickly, many components will break.
The maximum thermal change rate that the most sensitive component can withstand becomes the maximum allowable slope." However, if thermal elements are not used and yield is maximized, the slope can be adjusted to improve processing time.
Therefore, many manufacturers increase these slopes to the maximum universal allowable rate of 3.0°C/sec. On the contrary, if a solder paste containing a particularly strong solvent is used, heating the component too fast will easily cause an out of control process. Due to the degassing of volatile solvents, they may spill solder from the pads and solder plates.
Solder balls are the main problem of violent outgassing during the preheating phase. Once the circuit board heats up to temperature during the preheating phase, it should enter the constant temperature phase or the pre-reflow phase.
Constant temperature zone
Reflow soldering constant temperature zone is usually 60 to 120 seconds of exposure, used to remove solder paste volatiles and flux activation, where the flux group begins to oxidize and reduce on component leads and pads.
Excessive temperatures can cause solder splashing or balling, as well as oxidation of solder paste attachment pads and component terminals. Similarly, if the temperature is too low, the flux may not be fully activated.
Welding zone
The common peak temperature is 20-40°C higher than the liquidus. [1] The limit is determined by the component with the lowest high temperature resistance (the component most susceptible to heat damage) on the assembly.
The standard guideline is to subtract 5°C from the maximum temperature that the most vulnerable component can withstand to reach the maximum process temperature. It is important to monitor the process temperature to prevent exceeding this limit.
In addition, high temperatures (over 260°C) may damage the internal chips of SMT components and promote the growth of intermetallic compounds. Conversely, a temperature that is not hot enough may prevent the slurry from fully reflowing.
Cooling zone
The last area is a cooling area, which is used to gradually cool the processed board and solidify the solder joints. Proper cooling can inhibit the formation of excess intermetallic compounds or thermal shock to the components.
The typical temperature range of the cooling zone is 30-100°C. It is generally recommended that the cooling rate be 4°C/s. This is the parameter to be considered when analyzing the results of the process
Who we are?
CNSMT is a leading manufacture of SMT machines in China, we have our own factory produce China brand AOI, SPI, SMT conveyors, PCB Loader and unloader,PCB handling machines,PCB Cleaning machines, Stencil Cleaning machine,PCB Stacker/destacker loader and unloaders,pcb storage trolley, SMT feeder trolley, SMT feeder calibration jig,ESD tools...
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Why Choose CNSMT For your SMT Needs?
These are the reasons why many SMT factories around the world trusts CNSMT. We are not just after sales; we are after a long-term business relationship.
Company Information
CNSMT is the leading manufacturer and supplieir for SMT machines and Solution with over 10 years' experience in China. And we can also do OEM&ODM for SMT traders, we have vast of sources in SMT field,even you need used or new SMT equipments or other parts, we can help you get the best quality and competitive cost machines.
What we can do for you:
※ We have our own factory make SMT equipments and devices
※ We have a professional technich engineer team for produce machines
※ We can customize variety of SMT machines for you according your requirements
※ We buy and sell used and new SMT equipments all over the world
※ We provide you SMT full line machines and export to worldwide
※ Becoming the most reliable Chinese partner for you.
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