KY8030-2 PCB 3D Solder Paste Inspection Machine SMT Inline High End
KY8030-2 Inline SPI, High-end PCB solder paste inspection machine
3 times faster
Bar code that can recognize multiple puzzles
Bar code that can recognize multiple puzzles
Process optimization through 3D SPI + 3D AOI connection
With the ability to automatically compensate when the PCB board is bent
Accurately measure the area of the printed solder paste and calculate the volume of the solder paste
Gao Yong uses dual light sources to completely solve the shadow problem
Any program can be edited within 10 minutes
Unique SPI technology using 2D+3D technology
| Required inspection items for 3D SPI | |||||
| Require | Solution | ||||
| Solve the shadow problem | Moore's article technology to eliminate shadows & bidirectional illumination light system | ||||
| Real-time compensation of plate bending (2D+3D scheme) | • Board bending compensation (Pad Referenceing+Z-Tracking) | ||||
| Easy to operate | • Renewal GUI, color 3D picture | ||||
| Foreign body detection | • 3D foreign body detection function (optional) | ||||
| Test items | Test items | • Volume, area, adjustment, offset, bridging, shape, coplanarity | |||
| Bad type | • Missing printing, more tin, less tin, even tin, bad shape, offset, coplanarity | ||||
| Detection performance | Camera resolution | 15μm | 20μm | 25μm | |
| FOV/size | 30×30mm(1.18×1.18 inch) | 40×40mm(1.57×1.57 inch) | 50×50mm(1.97×1.97 inch) | ||
| Full 3D inspection speed | 22.5-56.1cm²/s (Inspection speed varies with PCB and inspection conditions). | ||||
| Minimum solder paste pitch | 100μm (3.94 mils) | 150μm(5.91 mils) | 200μm(7.87 mils) | ||
| camera | • 4 megapixel camera | ||||
| illumination | • IR-RGB LED (option) | ||||
| Z axis resolution | 0.37μm | ||||
| High accuracy (correction module) | -1μm | ||||
| 01005 detection capability | ＜10% at 6 Ó | ||||
| Gage R&R(±50% tolerance) | |||||
| Maximum detection size | 10×10mm | ||||
| Maximum detection height | • 400μm (option 2mm) | 0.39×0.39inch | |||
| Minimum land pitch | • 100μm (150μm solder paste height) | 15.75mils(选项78.74 mils) | |||
| Corresponding to various color substrates | • Can | 3.94 mils(5.91mils锡膏高度) | |||
| Substrate correspondence | Track width adjustment | • automatic | |||
| Track fixing method | • Fixed front rail/fixed rear rail (fixed at shipment) | ||||
| software | Supported input format | • Gerber data (274X,274D),ODB++ (option) | |||
| Programming software | • ePM-SPI | ||||
| Statistical management tools | SPC Plus: | ||||
| Histogram,X-bar&R-Chart,X-bar&S-Chart,Cp&Cpk,%Gage R&R | |||||
| Real-time SPC&Multiple Display | |||||
| SPC alarm | |||||
| KSMART remote monitoring system | |||||
| Convenience of operation | • Generate Library according to component size to set inspection conditions | ||||
| KYCal: Automatically calibrate camera/lighting/height | |||||
| operating system | • Windows 7 Ultimate 64 bit | ||||
| Add-on | •1D&2D Handy Barcode Reader | •Standrad Calibration Target | <span st | ||
| Solutions | |||||
Product Features
3D solder paste inspection (dual lighting)
High-speed and efficient production line optimization 3D SPI
Use dual-channel lighting to solve the shadow problem
In order to ensure the rapid printing process of cases, it is basically equipped with Easy UI and SPC Plus programs
M, L, XL models and Dual Lane systems are available.
Certification:
Shippment and delivery:
Our products are sold all over the world, you can rest assured.
